Kirin 9050 apparently has 1.5 micron pitch HBI die-to-wafer.

Kirin 9050 apparently has 1.5 micron pitch HBI die-to-wafer. I spoke to a US packaging company several weeks ago with standard high performance HBI tools, saying they're beyond 0.75 micron pitch. It's just a case of manufacturing at scale. They're also seeing scaling better on