媒体称台积电熊本第二晶圆厂拟于2028年12月投产,采用3nm制程
媒体报道称,台积电熊本第二晶圆厂计划于2028年12月投产,制程从原计划的6/12nm改为3nm。新的3nm生产计划提出一期产能为每月6,000片晶圆;原文关于台积电总资本支出的内容不完整。
同一新闻,精选展示《日本经济产业省核准台积电熊本二厂生产计划变更,拟生产3nm芯片》
X(推特)上的财经、科技与宏观账号
媒体报道称,台积电熊本第二晶圆厂计划于2028年12月投产,制程从原计划的6/12nm改为3nm。新的3nm生产计划提出一期产能为每月6,000片晶圆;原文关于台积电总资本支出的内容不完整。
同一新闻,精选展示《日本经济产业省核准台积电熊本二厂生产计划变更,拟生产3nm芯片》
11:20: Achievement: Release a node in a rush and have 500 splits miss spec. 11:20: Achievement: Ship it, we'll fix it in the PDK. 11:20: Achievement: Release 1 node to manufacturing. 11:20: Milestone: your first keepsake! Sealed vial of the first high-k precursor. 11:20:
Join the Terafab project. The value of the output of this massive structure will rank in the top 20 of country GDPs! 引用 @johnfederspiel:We only hire the best for Terafab. If you’re passionate and want to build the future with us apply here: https://t.co/elDXUFZ4Io Or send resume to jobs@terafab
If you’re a world-class chip design or production engineer, consider joining SpaceX or Tesla. How cool would it be to iterate on designs and customize production machines at lightning speed? 引用 @pequityresearch:Elon Musk wants to do 10 chip designs a year with Terafab compared to 1 every 2 years:
I heard you like FD-SOI, so @GlobalFoundries is going single digit nm-class performance. Designed in Europe. https://t.co/S7fqAMYmw5
媒体报道称,台积电与GlobalFoundries签署了一项20亿美元的多年期硅中介层供货协议,硅中介层是台积电CoWoS先进封装的重要组件。报道还称,随着供货协议扩大,GlobalFoundries将扩充其纽约州Malta厂区产能。
台积电2026年前三季度收入已超过2025年全年。按台积电数据,新台币收入为NT$3.90 trillion,对比2025年全年的NT$3.81T;美元口径分别为US$122.80 billion和US$122.42B,其中2026年总额为作者自行计算。
台湾检方起诉10名公司高管,指控他们涉嫌向中国转售美国军用级芯片。涉事芯片来自Analog Devices和Texas Instruments,可用于多种军事装备;指控包括欺诈、伪造和金钱相关罪名。
Taiwan Op-Ed: Elon Musk would not be a good partner for TSMC because he is pro-China for business reasons and “extremely unfriendly to Taiwan”, one media says, adding that if TSMC worked on TeraFab, other clients would likely be unhappy because they don’t have joint venture fabs
推文调侃有人只看视频标题,并引用一条对比:May 时 @IanCutress 称“华为 Tau 定律,这什么都不会改变!”,October 时 @Qualcomm 同意获得支撑 @Huawei 新型 LogicFolding 的专利许可。
Kirin 9050 apparently has 1.5 micron pitch HBI die-to-wafer. I spoke to a US packaging company several weeks ago with standard high performance HBI tools, saying they're beyond 0.75 micron pitch. It's just a case of manufacturing at scale. They're also seeing scaling better on
A sufficiently large quantity is a quality all its own. Big difference between bacteria with one cell and a human with 35 trillion cells, even though both are made of cells. 引用 @XFreeze:Anything TSMC contributes to Terafab would basically be supplemental Terafab itself is going to be absurdly ma